Semiconductor

TSV Furnace / eFurnace

Wafer processing equipment that heats wafers in semiconductor manufacturing using radiant heat from a vertical resistance-heating type heater

Specifications

Product Specifications

Wafer Type

300mm SEMI STD-Notch type

Cassette Type

FOUP 25 wafers Semi Standard

Flat Zone

900mm or more

Process

Anneal, Cure, Oxidation

Process Temperature

100 < 200 < 500 < 900 < 1200 ℃

Foup Stack Capa.

16 Foup

Variable Pitch

6~12mm

Safety

S-Mark, CE

Host Communication

SECS/GEM