We supply thermal processing and precision environmental control equipment for the entire wafer manufacturing process.

Equipment that passivates silicon dangling bonds through high-pressure D2 anneal
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Diffusion furnace for wafer oxidation and deposition processes

Vacuum annealing equipment for Mold Wafer / FAN-OUT processes
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Furnace dedicated to low-temperature TSV processes
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Pressurized cure process equipment for wafers
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High-precision thermal processing furnace lineup

Humidity Conditioner Module
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Precision temperature-control chiller systems
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Smart wafer storage system
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High- and low-temperature test chamber
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