R&D

R&D

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Overview

Technology Competitiveness

Building on unrivaled proprietary technology in semiconductor and display thermal processing equipment, YEST develops new equipment for next-generation processes.
Centered on our Pyeongtaek R&D Center, we accumulate core technologies in thermal processing, precision environmental control, and water electrolysis,
and continuously research safe, high-efficiency solutions tailored to customer needs.

01
Thermal Processing

From atomic-layer thin-film deposition (ALD) to high-pressure anneal and oxidation, we research core thermal processing technologies for next-generation semiconductor and display processes.

02
Precision Environmental Control

With ultra-low-temperature chillers and precise control of humidity, pressure, and vacuum, we secure the uniformity and stability of the process environment.

03
Water Electrolysis & Green Hydrogen

We improve the efficiency and durability of AEM water electrolysis systems and secure scale-up technology from small- and mid-scale to MW-scale, large-capacity systems.

Semiconductor R&D
HPO (Hi-Pox)

As device miniaturization intensifies, this equipment controls side effects such as Pattern Collapse and Warpage that occur during high-temperature oxide growth and Anneal.
To achieve the same effect even at lower process temperatures, oxidation and Anneal are performed under high pressure.

  • Wafer / Cassette — 300mm · Foup · Flat Zone >1000mm
  • Process — Wet & Dry ox, Anneal
  • Process Temp / Pressure — 250℃ ~ 900℃ · Max 30bar
  • Advantages — High-pressure Wet & Dry ox capability · Equipped with Vacuum & Boat Rotation functions
  • Clean — In-Situ HF Clean and DCE Clean supported
  • Control — Simultaneous high ↔ low pressure operation (advantageous for Defect control)
HPO (Hi-Pox)01
Semiconductor R&D - cleanroom thin-film deposition research02
Semiconductor R&D
ALD Furnace Development

Through precise control of temperature, pressure, flow, and vaporization systems, we are developing a next-generation furnace that deposits atomic-layer thin films (ALD).
By securing the uniformity and stability of High-k dielectric processes, it addresses advanced semiconductor processes.

  • Supported Wafer — 12″(300mm) · FOUP, Flat Zone 500mm
  • Process — High-k ALD (single-layer, composite, and multi-component dielectric deposition)
  • Process Temp — 200 ~ 350℃ · Variable Pitch 6.6 ~ 10mm
  • Process Materials — N2 · O3 · ZrO2 · HfO2 · H2O2 · TMA
  • Transfer / Options — WTR·FTR·FIMS·Loadport / Dry Pump·Plasma·O3 Generator·Scrubber
Display R&D
Low-Vacuum PCO

We research process equipment that removes fine bubbles and cures the surface of substrates coated with an interlayer insulating material (CCL Film).
By minimizing VOID and increasing adhesion strength, it improves the quality and reliability of display processes.

  • Effect — Minimized VOID and increased adhesion strength
  • Work Size — 510(W) × 515(D) × 0.1 ~ 2.5T
  • Pressure — Max 10kg/㎠ (design 12 · hydraulic test 13) · uniformity ±0.1kg/㎠
  • Temperature — Max 220℃ · uniformity ±3℃ · ramp-up 4℃/min
  • Vacuum — 5Torr / 2min
Display R&D - precision inspection research03
Green Hydrogen R&D - AEM water electrolysis research04
Green Hydrogen R&D
AEM Water Electrolysis System

We are conducting research to improve the efficiency and durability of AEM (Anion Exchange Membrane) water electrolysis systems, and are securing scale-up technology from small- and mid-scale to MW-scale, large-capacity systems.
Through green hydrogen production linked to renewable energy, we are preparing for carbon neutrality.

  • AEM Multicore (MW-scale) — Hydrogen production 210 Nm³/h · Purity 99.9% (99.999% with dryer)
  • Power Consumption — 1,008kW (4.8kWh/Nm³) · Operating pressure ~35bar · Weight approx. 30t
  • Startup — Within seconds (Hot) / Within 30 min (Cold)
  • AEM Cluster (Small/Mid-scale) — Max 30 Nm³/h · Power consumption max 180kW
  • Footprint — 2.44 × 6.06 × 2.59 m (20ft container)
Innovation

Through relentless technological innovation,
we set the standard for future processes.