Semiconductor

Vacuum Furnace VF-300

Vacuum annealing equipment for Mold Wafer and FAN-OUT

Specifications

Product Specifications

Temp Uniformity(Keep)

300mm SEMI STD-Notch type / FOUP 25·13 Wafers / 50 Wafer [Boat:50Slot]×2 Chamber

Ramp Up Rate

5℃/min

Down Rate

3℃/min

Base Vacuum

10 Torr

Process Pressure

50 Torr

Temp

~400℃ (MAX 500℃)

Process O2 Concentration

10 ppm

Time to Reach O2 Concentration

20 min